中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装

• 微电子制造与可靠性 •    

LTCC滤波器侧面印刷工艺技术研究

杨靖鑫,董兆文, 吴申立,丁小聪, 麻茂生   

  1. 中国电子科技集团公司第四十三研究所
  • 收稿日期:2020-05-06 修回日期:2020-06-18 出版日期:2020-06-19 发布日期:2020-06-19
  • 通讯作者: 杨靖鑫,董兆文, 吴申立,丁小聪, 麻茂生

Study on the Side Printing Technology of the LTCC Filter

  • Received:2020-05-06 Revised:2020-06-18 Online:2020-06-19 Published:2020-06-19

摘要: 本文主要针对LTCC滤波器电气连通率较低的问题进行了相关研究。通过比较,发现自制的LTCC滤波器端口导带露出端偏薄,从而导致在端口印上导带之后与中间层导带在端口处的电气连接性能不佳。通过进一步的分析,发现导致滤波器端口导带过薄的原因有两个:一、生瓷切片时刀口的带瓷;二、烧结过程中导体浆料与瓷体材料的收缩率不一致导致导体内缩。文章最后,针对性的提出了相应的改进措施,获得了最优化的工艺技术方案。

关键词: LTCC滤波器, 端头侧印, 收缩率, 网版套印

Abstract: This paper mainly studies the problem of low electrical connection rate of the LTCC filter. By comparison,The self-made LTCC filter has a thin side at the exposed end of the tape, which results in poor electrical connection with the intermediate layer conduction band at the port after the conductor is printed on the side. Through further research and analysis,It is found that there are two reasons why the side conduction band of the LTCC filter is too thin. The first factor is that the edge of the porcelain is sliced with porcelain, and the second factor is that the shrinkage of the conductor paste and the ceramic material during the sintering process is inconsistent, which causes the conductor to be indented inside. Finally, the corresponding improvement measures are proposed in a targeted manner, and the optimized process technology solution is obtained.

Key words: LTCC Filter, Side Printing, Shrinkage Factor, Screen Overlay Printing Technology